News

Design And Reuse3h
Inside A Car's Digital Brain: MCUs, the Engine Powering SDV Innovation
Input/Output Overload: Modern vehicles have over 90 smart sensors, 800 sensors and loads, requiring zonal MCUs to have denser ...
Design-Reuse7y
Silicon Creations Showcases Latest IP Portfolio at TSMC Technology Symposium
SUWANEE, Ga. -- April 25, 2018 -- Silicon Creations, a leading supplier of high-performance analog and mixed-signal intellectual property (IP), will showcase a number of technology advances in its ...
Design And Reuse1d
Analogue Insight and Tetrivis Announce Joint Development of "Eurytion RFK1," a UCIe based 12nm Ka/Ku-Band RF Chiplet Transceiver
As part of this initiative, Analogue Insight and Tetrivis have signed a Memorandum of Understanding (MoU) to jointly develop the chiplet, aligning their IP roadmaps, technology resources, and customer ...
Design-Reuse1d
Synopsys Delivers Industry's First MIPI I3C IP for Sensor Connectivity Targeting IoT and Automotive Applications
MOUNTAIN VIEW, Calif. -- April 26, 2016 -- Synopsys, Inc. (Nasdaq:SNPS) today announced immediate availability of the industry's first MIPI® I3C SM controller IP to ease the integration of multiple ...
Design And Reuse2d
EnSilica expands satcoms user terminal portfolio with dual-beam, dual-polarization Ku-band analogue beamformer chipset
The ENS92051 is the dual-beam Ku-band receiver (Rx) supporting eight channels with separate amplitude and phase control. The Rx carrier frequency range is 10.7 to 12.75 GHz with an instantaneous ...
Design And Reuse3d
Expedera s Origin Evolution NPU IP Brings Generative AI to Edge Devices
Expedera launches its Origin Evolution NPU IP, bringing hardware acceleration to meet the computational demands of running ...
Design And Reuse2d
GlobalFoundries partners with A*STAR to accelerate advanced packaging innovation
SINGAPORE -- May, 20 2025 – GlobalFoundries (Nasdaq: GFS) (GF) today announced plans to expand its capabilities in advanced packaging through a new Memorandum of Understanding (MOU) signed with the ...
Design-Reuse1y
Cadence Unveils Palladium Z3 and Protium X3 Systems to Usher in a New Era of Accelerated Verification, Software Development and Digital Twins
SAN JOSE, Calif. -- April 18, 2024 — Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence ® Palladium ® Z3 Emulation and Protium ™ X3 FPGA Prototyping systems, a revolutionary ...
Design And Reuse2d
SiFive Collaborates with Red Hat to Support Red Hat Enterprise Linux for RISC-V
"Native Red Hat Enterprise Linux support on SiFive’s HiFive Premier P550 board offers developers a substantial enterprise-grade toolchain for RISC-V. This is a pivotal step forward in enabling a ...
Design And Reuse2d
The RISC-V World Sees Changes, Milestones, and Innovations
In fifteen years, RISC-V has gone from an academic project at UC Berkeley to one of the major technological trends in compute. The ISA has since flourished in an era that appreciates its royalty-free, ...
Design And Reuse8d
Rapid eFPGA Configurator
A Paradigm Shift in eFPGA Customization. Advancing Programmability in the Next Generation of SoCs . In an era of continual ...
Design-Reuse8mon
SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market
Santa Clara, Calif. - September 2, 2024 — Today SiFive, Inc. announced that it has licensed its SiFive Automotive RISC-V IP cores to Arkmicro Technologies (Shenzhen), accelerating the adoption of RISC ...