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Electrothermal analysis; rise of software-defined products; predictive maintenance and functional safety; satellite ...
The industry has already demonstrated gains using AI in tight iteration loops, but how does that evolve to cover larger ...
An Inter-Chiplet Interconnect Topology for Chiplet-based Systems using Organic and Glass Substrates” was published by ...
On-die Digital Impedance Sensing for Chiplet and Interposer Verification” was published by researchers at Worcester Polytechnic Institute. Abstract “The increasing complexity and cost of manufacturing ...